| 摘要 |
A plurality of pad electrodes are formed on a first surface of an IC wafer, and a solder layer is formed on each of the pad electrodes. The first surface of the IC wafer including solder layers is coated with a flux layer, and solder layers are reflowed to round each of the solder layers, thereby forming each solder layer into a solder bump. An adhesive tape is adhered on the flux layer, and a second surface opposite to the first surface of the IC wafer is ground to form a flip chip semiconductor device. |
