| 摘要 |
PURPOSE:To obtain a uniform film thickness and uniform film quality, by supplying a gas which flows in a direction parallel to the plane of a wafer, and rotating either the wafer or a gas supply means furing reaction. CONSTITUTION:Each of a plurality of wafers 10 are horizontally mounted on a wafer retaining jig 6, and the rotation of a motor 5 is transmitted to the wafers 10 through the jig 6 so that the wafers 10 are rotated while maintaining their position in which they are parellel with the horizontal cross-section of a reaction vessel 1. A reaction gas is supplied unifomly to the plurality of wafers 10 from a polurality of gas supply ports 12A. Since gas discharge ports 13A are positioned so as to substantially oppose the gas supply ports 12A across the wafers 10, the reaction gas supplied to the wafers 10 flows without any turbulence in a direction parallel with the main surface of each wafer 10, so that various portions of the main surface of each wafer 10 uniformly contact the reaction gas. The reaction gas is gradually consumed through the reaction and causes a density gradient. However, since the wafers 10 are rotated, the effects of density gradient on various portions of each wafer 10 cancel each other out, and a uniform reaction is thereby carried out. |
