发明名称 PARTIAL PLATING APPARATUS
摘要 PURPOSE:To prevent the substitution deposition of a metal for plating and to improve the quality of plating by efficiently cleaning a strip, a masking means and a backing plate every time one plating cycle is finished. CONSTITUTION:When the spouting of a plating soln. from a nozzle 27 is stopped after finishing plating, a backing plate 35 is moved backward so as to leave a gap 45. Washing water 49 in a tank 47 is sent to a nozzle 55 with a pump 51 through a pipe 53 and is spouted into the gap 45 in the direction of arrows. The plating soln. stuck on the backing plate 35 and a masking plate 23 during plating is washed off. A lead frame 12 is then moved forward by a prescribed length in the longitudinal direction and is stopped at the next plating position.
申请公布号 JPS60255992(A) 申请公布日期 1985.12.17
申请号 JP19840110937 申请日期 1984.06.01
申请人 SHINKOU DENKI KOGYO KK 发明人 HORI KUNIYUKI;KITAZAWA KIYOSHI
分类号 C25D5/02;C25D21/00;H01L23/50 主分类号 C25D5/02
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