| 摘要 |
An internally cooled semiconductor package including a wafer-like semiconductor body with at least two electrical elements, one at a relatively flat surface of the body. A wall of high electrical and heat conductive material abuts the flat surface of the semiconductor body to be in good heat conductive relation therewith and in electrical contact with the same. A fluid flow heat exchanger is on the other side of the wall in heat exchange relation therewith and along with the wall and other components serves to encapsulate the semiconductor.
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