| 摘要 |
PURPOSE:To provide the titled wire having excellent solderability and resistances to wear, moist heat and overcurrent, by applying a compsn. contg. polyurethane, polyvinyl formal and an epoxy resin to a conductor and baking it. CONSTITUTION:100pts.wt. polyurethane (A) obtd. by condensing a polyisocyanate having an MW of 300-10,000 with a polyol having an average MW of 200- 10,000 and a hydroxyl value of 200-500 in a ratio of 0.4-2 equivalents of the hydroxyl group per equivalent of the isocyanate group, 0.05-10pts.wt. polyvinyl formal (B) having an MW of 20,000-500,000, 2-10pts.wt. epoxy resin (C) having an epoxy equivalent of 150-10,000 and an MW of 500-200,000 and optionally curing accelerator catalyst and an appropriate quantity of an org. solvent (e.g. phenol) (D) are stirred at room temp. to 60 deg.C until a homogeneous compsn. is formed. The compsn. is applied to a conductor directly or through other insulating film and backed at 300-400 deg.C fer 4-100sec.
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