| 摘要 |
PURPOSE:To improve the thermal impact resistance and the moisture resistance by a method wherein the stress generated by the difference in coefficient of thermal expansion between the sealing material and the metallic frame is dispersed by boring holes in the metallic frame of the part where a semiconductor element is fixed to this frame. CONSTITUTION:Four or more of holes 6 of 0.3mm. or more diameter is provided in the metallic frame of the part (island) 1 of the titled device, formed by mounting a semiconductor element on the metallic frame and molding with sealing mold material, where said element is fixed to this frame, on the diagonal lines from corners to corners of the element-mounting surface. This prevents the generation of cracks by dispersing the stress generating by the difference in coefficient of thermal expansion between the sealing material and the metallic frame in a small amount through the holes 6. |
