发明名称 FORMATION OF RELIEF COATED FILM
摘要 PURPOSE:To form clear relief by coating an aq. putty on a substrate, superposing a photocurable covering composition thereon, adhering closely a patterned sheet, irradiating light, and removing the putty. CONSTITUTION:An aq. putty is firstly coated on a substrate so that a dried film having about 0.5-2mm. thickness may be obtained, and a photocurable covering composition is coated thereon. A sheet patterned with a light-transmissive part and a part which does not transmit light is adhered to or made to approach to said coated surface, and ultraviolet rays are irradiated thereon. Then the sheet, the uncured part of the coated film, and the exposed putty layer under said uncured part are removed. A relief coated film having deep ruggedness is obtained in this way.
申请公布号 JPS60255175(A) 申请公布日期 1985.12.16
申请号 JP19840111845 申请日期 1984.05.31
申请人 DAINIPPON TORYO KK 发明人 TANAKA SATOSHI;SAKURABA TOSHIHIKO;MAEDA HIROMI;MATSUDA MITSUHIRO;KOUNO MITSURU;YUASA TAKAHIRO;OONO TOSHIHARU
分类号 B05D5/06;B05D7/24 主分类号 B05D5/06
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