| 摘要 |
PURPOSE:To contrive the effective utilization of the chip area, and to secure circuit functions and characteristics by a method wherein the internal wiring among bonding pads is omitted by connecting a plurality of bonding pads of a semiconductor IC with bonding wires. CONSTITUTION:A VCC power source pad 11 and a GND power source pad 12 are connected to stitches 13 and 14 with bonding wires, respectively. Circuit functional blocks 15-18 are arranged only on the GND pad side and the VCC pad side. VCC wiring 19 and GND wiring 20 on the chip are performed only on two sides where the blocks 15-18 are present. One-ends of the wirings 19 and 20 are provided with a VCC wiring bonding pad 21 and a GND wiring bonding pad 22, respectively. Then, the pads 21 and 22 are bonded to each other with bonding wires. |
