| 摘要 |
<p>PURPOSE:To improve the heat dissipation in air cooling by placing a semiconductor of large Peltier coefficient whose direction of conduction has been set in a direction of endothermic action in the plane of contact on the IC chip side and exothermic action in the plane of contact on the heat dissipating side. CONSTITUTION:The space leading through a holder 11 which holds an IC chip 1 to heat dissipating fins 13 is formed in an insulator substrate 12 of small thermal conductivity. Then, a semiconductor 16 of large Peltier coefficient, small thermal conductivity, and small resistivity is placed in the space. Both surfaces of the semiconductor 16 are provided with electrodes 17 and 18 of ohmic contact, and insulator thin films 19 and 20 are arranged between the films 13 and the electrode 17 and between the chip 1 and the electrode 18, respectively. By utilizing Peltier effect, the semiconductor 16 is conducted in a direction of exothermic action in the plane of contact between the electrode 17 and the semiconductor 16 and endothermic action in the plane of contact between the electrode 18 and the semiconductor.</p> |
