发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve yield of single crystallization of polysilicon island by optimizing film thickness of polysilicon cap layer in the method for single-crystallizing the polysilicon island on an insulated layer with the indirectly heating type laser heating method. CONSTITUTION:In the method for single-crystallizing noncrystal silicon island 14 which is provided on an insulated layer and is covered with a separation cap layers 15, 16 having thermal conduction coefficient which is lower than that of silicon and an energy beam absorbing cap layer 17, the yield of single-crystallization can be enhanced by setting thickness of the energy beam absorbing cap layer 17 thinner than that of island 14. Namely, the yield was 100% in case thickness of polysilicon island 14 was 4,000Angstrom and thickness of cap layer 17 was 2,300Angstrom .
申请公布号 JPS60254723(A) 申请公布日期 1985.12.16
申请号 JP19840111416 申请日期 1984.05.31
申请人 FUJITSU KK 发明人 MUKAI RIYOUICHI
分类号 H01L21/20;H01L21/268 主分类号 H01L21/20
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