| 摘要 |
PURPOSE:To supply positively brazing material onto brazing portions of a semiconductor device and to improve yield. CONSTITUTION:After the cylindrical collet 1 by which a brazing material 2 is being sucked and held, is transferred over the brazing portion 3 of a lead frame, the collet 1 is lowered to pressure the brazing material 2 against the brazing portion 3. Thereafter, the needle 5 which is being mounted in the hollow section of the cylindrical collet 1 is lowered to support the brazing material 2 on the brazing portion 3. With the brazing material 2 supported by the needle 5, the cylindrical collet 1 is rised by a collet driving means. When the collet 1 reaches a predetermined height, the needle 5 begins to separate from the brazing material 2 and to rise. |
