| 摘要 |
PURPOSE:To enhance the heat transfer coefficient on the side of a cooling surface and enhance the performance of a heat transfer device, by a construction wherein a liquid is appropriately contained in a vessel, and a bubble film formed at a boiling liquid surface part is brought into contact with a condensed liquid film formed on a top surface. CONSTITUTION:The heat transfer device in which an evaporable liquid is contained in a vessel and heat is transferred from a heating surface to a cooling surface by the boiling and condensing actions of the liquid, is so constructed that the ratio Hi/Hs of the initial distance Hi between the liquid surface with no heat applied to the heating surface and the heating surface to the distance Hs between the heating surface to the cooling surface is in the range of 0.02-0.3. Accordingly, the bubbles (bubble film) 6' generated by boiling make contact with the condensed liquid film 7 formed on the top surface 3, thereby accelerating the dropping of the film 7. Namely, when the condensed liquid film 7 makes contact with the surface of the bubble film 6', the film 7 is pulled and removed downward by the surface tension of the bubble film 6', resulting in that the quantity of a thick liquid film part at the top surface 3 is reduced, while the quantity of a thin film part is increased, thereby enhancing the heat transfer coefficient. |
