| 摘要 |
PURPOSE:To prevent or reduce the fatigue failure of a heat conductive path by a method wherein the heat conductive path to be provided between a cooling means and the heat generating device to be cooled is constituted by a part consisting of a sintered body having silicon carbide as a main ingredient and another part consisting of a low melting point metal, thereby enabling to obtain an excellent cooling efficiency. CONSTITUTION:A heat conductive pad 20 consisting of a low melting point metal, which is metallically coupled to the chip 10 and the housing 16, is provided between each chip 10 and each part of the housing 16 opposing to the chip 10, and said pad 20 constitutes the heat conductive path ranging from the chip 10 to the housing 16. A silicon carbide sintered body is selected as the material of the housing 16, and an eapecially excellent efficiency is displayed when alumina ceramic is used as the base material of a substrate 12 and silicon is used as the material of the chip 10. To be more precise, the silicon carbide sintered body has the thermal expansion coefficient extremely approximate to that of silicon, and the thermal fatigue failure of a heat conductive pad 20 can be prevented. Also, the thermal fatigue failure of the sealing member 17 located between the substrate 12 and the housing 16 can be prevented. |
