| 摘要 |
FIELD: designing microelectronic pieces of equipment. ^ SUBSTANCE: electronic module dimensions depend on dimensions of greatest-size shape-forming electronic components in combination with other components inserted in micro-boards. In the process use is made of both sides and entire space of components and micro-boards for disposing electronic components manufactured by using semiconductor, thin-film, and thick-film technologies. During oriented joining of all separate components and micro-boards into stack by adhesion conductors are deposited onto their end surfaces forming common plane to interconnect them and to form contact pads with external ball leads deposited onto the latter. Assembled module is enclosed in mechanically strong and electrically insulated sealing shell. All internal and external interconnections are made using highly reliable vacuum evaporation method. ^ EFFECT: enhanced packing density and reliability of three-dimensional electronic modules. ^ 5 cl, 5 dwg |
