Soldering method and apparatus for carrying it out

摘要

In a soldering method for printed circuit boards, in which a pasty soldering agent is melted after application to the boards, the boards pass through a tunnel-shaped reflow furnace (1) on a conveyor (3). The furnace (1) is subdivided into a preheating zone (Z1), a rapid-heating zone (Z2) and a cooling zone (Z3). In the preheating zone (Z1), the boards are preheated by means of radiant heaters. In the rapid-heating zone (Z2), the temperature of the boards is rapidly increased by means of at least one heater fan (4) to a value lying above the melting point of the soldering paste so that the soldering paste is melted. The boards are then exposed to a coolant flow in the cooling zone (Z3). <IMAGE>