发明名称 REACTIVE ION BEAM ETCHING APPARATUS
摘要 PURPOSE:To etch uniformly a material to be etched in a reactive ion beam etching apparatus provided with a reactive ion generating part and an ion leading- out electrode by curving the electrode so as to distribute uniformly reactive ion beams. CONSTITUTION:A reactive ion beam etching apparatus is composed essentially of a reactive ion generating part 1 and an ion leading-out electrode 5a having projected curvature at the central part on the side farther from the part 1 and placed opposite to the outlet of the part 1. In the generating part 1, introduced reactive gas 2 is converted into reactive ions 4 in the state of plasma. The electrode 5a is kept at necessary potential, leads out the reactive ions 4, and passes them as reactive ion beams 8.
申请公布号 JPS60251284(A) 申请公布日期 1985.12.11
申请号 JP19840109847 申请日期 1984.05.28
申请人 MITSUBISHI DENKI KK 发明人 WATAKABE YAICHIROU;MATSUDA SHIYUUICHI
分类号 C23F4/00;H01L21/302;H01L21/3065 主分类号 C23F4/00
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