| 摘要 |
A process of manufacturing a ceramic circuit board, wherein at least dielectric ceramics and a conductor paste of base metal are co-fired, comprising the steps of preparing the conductor paste containing an organic material which is thermally decomposed at a temperature higher than a decomposition point of an organic binder contained in the dielectric ceramics, and forming a circuit pattern of the conductor paste containing the organic material. Alternatively, the process comprises the steps of forming the circuit pattern of the conductor paste and covering the formed circuit pattern with the organic material. The process further comprises the steps of thermally decomposing the organic binder in an oxidizing atmosphere at a temperature lower than the decomposition point of the organic material, and thermally decomposing the organic material in an atmosphere having a partial oxygen pressure lower than that of the oxidizing atmosphere. |
