发明名称 TARGET FOR SPUTTERING
摘要 PURPOSE:To obtain a thin film having a uniform composition distribution by rolling up thin plates in a piled state so that the ratio in thickness between the thin plates is made equal to the ratio in the composition of a thin film to be formed and by using a cross-section of the resulting roll for a target as a face to be sputtered. CONSTITUTION:Thin plates are rolled up in a piled state so that the ratio in thickness between the thin plates is made equal to the ratio in the composition of a thin film to be formed. The resulting roll 1 is adhered to a copper backing plate 3 with an adhesive layer 2 of In, and the top of the roll 1 is polished to form a target. A thin film having a uniform composition distribution is obtd. by using the target.
申请公布号 JPS60251271(A) 申请公布日期 1985.12.11
申请号 JP19840107602 申请日期 1984.05.29
申请人 HITACHI KINZOKU KK 发明人 SHIDORI KUNIO;SHIBATA RIYOUICHI
分类号 C23C14/34;(IPC1-7):C23C14/34 主分类号 C23C14/34
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