| 摘要 |
A integrated circuit packaging and method of making the same integrate a heat-dissipating module within the integrated circuit packaging, so that it allows thermal resistance reducing in the packaging level to achieve the effect of partly dissipating heat and decrease the temperature of a chip effectively. The integrated circuit packaging includes a substrate, a semiconductor die, a heat-dissipating module and a protection layer. The substrate has an inner circuit formed on a first surface, and an outer circuit formed on a second surface of the substrate and electrically connected to the inner circuit. The semiconductor die is mounted on the first surface of the substrate such that the plurality of bond pads thereon contact the inner circuit. The heat-dissipating module includes a heat conduction device, and the heat conduction device via a flat end surface thereof contacts and bonds with a reverse surface of the semiconductor die. The protection layer covers the exposed part of the substrate, the exposed part of the semiconductor die and the exposed part of the end surface of the heat conduction device connected with the semiconductor die. ® KIPO & WIPO 2008 |
