| 摘要 |
PURPOSE:To perform partial plating in high velocity without necessitating masking treatment in an apparatus performing the partial plating by immersing the surface to be plated in the plating liquid film which is overflowed on the electrode surface of plating metal through the central path thereof and formed on the electrode surface. CONSTITUTION:A right circular cylindrical plating metal 11 is mounted on a pan 10 and joined to the anode of Dc power source and an article 15 to be plated is joined to the cathode of DC power source. In this example, the article 15 is circular cylindrical and the surface to be plated is the lower end surface 16. The shape of the article 15 is various and it is preferable that the outline shape of the electrode surface 17 of the metal 11 is made same as the outline shape of the article 15 and the size of the metal 11 is made larger a little than the article 15. At the time of the plating operation, the plating soln. 22 is overflowed on the electrode surface 17 with a feed pump 21 through a central feed path 18 of the metal 11 to form a liquid film 23 with the prescribed thickness. Then, the article 15 is descended and after the surface 16 is brought into contact with the liquid film 23 for only a prescribed period and the metallic deposit adheres thereon, the article 15 is elevated.
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