| 摘要 |
PURPOSE:To obtain a jet system solder tank which is capable of easily leading solder into a rear end edge part, etc., too, of chip parts, and exactly executing the soldering-treatment, by providing an auxiliary jet tank having a solder jet port for making a jet solder wave by a main jet port coarse, in a molten solder jet port of a main jet tank. CONSTITUTION:Molten solder 4 in a solder tank body 3 is pressed by rotating an impeller 8 and 8a by driving a motor 11, is sucked by a suction port 10 of a vessel housing 9 and is made to flow to a flowing pipe 12 and 15. Subsequently, this flowing molten solder 4 is jetted from a jet port 6 and 16 by pressing the inside of a main jet tank 5 and an auxiliary jet tank 13. Especially, in solder jetted from the jet port 6, a jet solder wave 16 is formed. On the other hand, jet solder from a jet port 14 of the tank 13 of the center part of the jet port 6 is operated so as to disturb a waveform of the solder wave 16, and the coarse solder wave 16 is formed. In this way, soldering is executed exactly by exactly leading the solder into the rear end part of chip parts 2 of a printed circuit board 1 immersed in this solder wave 16, and the part which forms such a shape as a recessed part by standing close to each other. |
