| 摘要 |
PURPOSE:To obtain a preferable heat sink package having no thermal distortion in the boundary of components by directly securing an IC element through an SiC ceramic insulating plate to a Cu-Mo heat sink. CONSTITUTION:An alumina ceramic substrate 2'' having a pad 6 connected with leads 5 of an IC element 1, input/output pins 3, a conductive pattern 7 between the pins and the pad on one surface, and a through hole 11 at the center, a Cu- Mo sintered alloy heat sink 10 contacted entirely with the other surface, and a thin insulating plate 9 in a recess formed are integrally secured by a brazing material to form a package. The element 1 is secured with high thermal conductive resin adhesive containing metal powder onto the plate 9, connected with the pad 6 and the leads 5, and hermetically sealed with a cover 4. Since the element 1, the memgers 2'', 9, 10 have substantially equal thermal expansion coefficient, extreme thermal distortion does not occur in the boundary of junction to improve the reliability. Themal resistance becomes extremely small by the thermal conductive member, thereby obtaining a package having good heat sink property. |
