Circuit board package and method of manufacture

摘要

A thermoformed structural foamed plastic container for electrical circuit boards and the like is provided with a conductive outer surface to dissipate electrostatic charges which can adversely affect the circuit elements disposed within the container. The container is preferably formed of integrally joined clamshell sections which are connected by an integral hinge and are provided with suitable support bosses and the like for securing an electrical circuit element within the package interior. The entire exterior or interior surface of the container is provided with a spray or brush deposited or vacuum applied conductive coating comprising carbon or other metallic substances. The container may be formed in two separate sections joined together with interlocking tabs and slots which provide electrically conductive engagement between the container sections. The container is preferably formed by thermoforming extruded foamed plastic sheet, spraying a solvent or water base electrically conductive coating onto the exterior and/or interior surfaces of the container, die cutting the container to its finished shape and coating the entire exposed surface of the container with an antistatic charge coating to provide a mass produceable, low cost package.