| 摘要 |
<p>PURPOSE:To improve the cooling efficiency by a method wherein circuit elements are mounted across strip form circuit modules adjacent to each other on a lattice-form circuit board with a plurality of circuit modules arranged in rectangular intersection. CONSTITUTION:Strip form circuit modules 11a, 11b, 11c, and 11d are made parallel in one direction, and the interval between those circuit modules is made narrower than a semiconductor element 6. Other strip circuit modules 12a and 12b are made parallel in the direction orthogonal thereto into a lattice-form structure of the circuit board 13. The semiconductor elements 6 are mounted across the modules 11a, 11b, 11c, and 11d in the same direction as the modules 12a and 12b, and the modules and the elements are held by connection with the electrode pads 6p of the elements. This construction allows the elements to be cooled by circulation of the coolant in its stirring while air bubbles rise out of both surfaces of the element 6. Therefore, the cooling efficiency increases about double.</p> |
