| 摘要 |
PURPOSE:To reduce the ground wire inductance by a method wherein source bonding pads for ground are grounded by being arranged also on the side of a drain bonding pad. CONSTITUTION:As the construction of the surface wiring part of the titled device, source bonding pads 3a are arranged also on the side of the drain bonding pad 5, so that the grounding for the operating part 2 can be carried out with source bonding wires 5 via source bonding pads 3 and additionally with source bonding wires 6a via source bonding pads 3a. This manner can reduce the ground wire inductance to approx. 1/2 and improves the escape of heat evolving in the operating part; accordingly, the titled device of high reliability can be obtained also by reduction of thermal inductance. |
