发明名称 SPATTER ETCHING MECHANISM IN VACUUM TREATMENT UNIT
摘要 PURPOSE:To eliminate the need of removing an arm for carrying a substrate from a spatter etching stage during the spatter etching treatment, by forming the substrate supporting section in the carrying arm of an insulating material so that the substrate can be subjected to spatter etching as it is placed on this section. CONSTITUTION:A vacuum treating unit is provided with a vacuum container 30, a spatter etching mechanism 31 received in the vacuum container 30 and a substrate conveying mechanism 34 having carrying arms shaped for carrying a substrate to be treated C. The substrate C placed on said carrying arm is positioned over the spatter etching stage 31 to be subjected to spatter etching. In this spatter etching mechanism of the vacuum treating unit, the substrate supporting sections 342-346 of the carrying arms on which the substrate C is placed are formed of an insulating material so that the substrate C can be subjected to spatter etching as it is placed on the substrate supporting section. Quartz may be used as said insulating material, for example.
申请公布号 JPS60249329(A) 申请公布日期 1985.12.10
申请号 JP19840104429 申请日期 1984.05.25
申请人 NICHIDEN ANELVA KK 发明人 TAKAHASHI NOBUYUKI
分类号 H01L21/677;C23F4/00;H01L21/302;H01L21/3065;H01L21/67;H01L21/68 主分类号 H01L21/677
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