| 摘要 |
PURPOSE:An epoxy resin composition markedly improved in moisture resistance and stability of quality and suited for sealing semiconductors, prepared by using a phosphorus catalyst having a functional group reactive with the components of an epoxy resin. CONSTITUTION:An epoxy resin composition containing a polyhydroxyphenol having a phosphorus atom in the skeleton or a derivative thereof (e.g., compounds of formulas I and II). Because said phosphorus compound contains a functional reactive with components of an epoxy resin composition, such as an epoxy resin, a curing agent, etc., it can markedly improve moisture resistance and the level of stability of quality, which can be improved to only a limited extent by a conventional additive-type catalyst. Therefore, the resin composition containing this reactive phosphorus catalyst is suitable for sealing semiconductors.
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