| 摘要 |
PURPOSE:To improve the marking quality and the marked appearance by marking on the molding surface formed by the lower die. CONSTITUTION:With a semiconductor pellet 5 fixed to the tab 4 of a lead frame turned upward, the lead frame 3 is sandwiched between the sealing upper die 1 and the lower die 2. Then, the titled device sealed with a resin 7 is produced by pushing the resin into a die space 6. Thereafter, a molding surface 7a in contact with the upper die 1 is turned downward, and a molding surface 7b in contact with the lower die upward, and these surfaces are marked with trade marks, trade names, etc. Since the marked surface is the molding surface formed by the lower die, the dirt of the lower die can be easily recognized and removed at the time of resin sealing; accordingly, the high marking quality and excellent appearance of the titled device are enabled. |
