发明名称 ALUMINUM ALLOY FOR BONDING WIRE
摘要 PURPOSE:To provide a titled alloy which forms a good ball and to enable connection by ball bonding with high strength at a low cost by specifying the compsn. consisting of Si, Mg, Mn, Zr, Ti, Cr, V, Cu, Be, Li, B and Al. CONSTITUTION:The aluminum alloy for a bonding wire contains 0.5-3wt% >=1 kinds among Si, Mg and Mn, 0.02-0.5% >=1 kinds among Zr, Ti, Cr, V and Cu and 0.001-0.3% >=1 kinds among Be, Li and B and consists of the balance substantially Al. Connection by ball bonding is made possible by forming the good ball while formation of the oxide film of Al is suppressed by such aluminum. An increased bonding strength and wire rod strength are thus attained. The softening and brittleness near the part to be formed with the ball are further prevented, by which the improvement in bonding strength and reliability is made possible.
申请公布号 JPS60248861(A) 申请公布日期 1985.12.09
申请号 JP19840104355 申请日期 1984.05.22
申请人 SUMITOMO DENKI KOGYO KK 发明人 NISHIDA MASANORI;YOKOTA MINORU;SAWADA KAZUO
分类号 C22C21/00;C22C21/02;C22C21/06 主分类号 C22C21/00
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