| 摘要 |
PURPOSE:To remove a target particle adhered excepting to a substrate using a reverse sputtering effect and to prevent the contamination of a substrate by connecting the part to which a target particle is adhered excepting of a substrate with a sputtering power source via a changeover means. CONSTITUTION:An electric power source 20 for sputter is connected via a sputter power source changeover device 40 for changing over a positive and negative voltages to a shielding plate 12 for adherence prevention to which a target particle is adhered excepting those to a substrate 30 fitted to the inside of a sputtering room 10 or to the inner wall of the sputtering room 10. The substrate 30 after a film formation is taken out and a sputter electrode 11 and the shielding plate 12 are shut off by a shutter 13. If, then, a discharge is taken place by making the shielding plate 12 a negative voltage with the sputter power source changeover device 40, the target particle adhered to the shielding plate 12 is removed by a reverse sputtering effect. |
