| 摘要 |
PURPOSE:The titled composition that contains a specific solid epoxy resin and a curing agent, thus being suitable for use as a powder coating, adhesive and a forming material, because it has low melt viscosity to improve space-filling properties and showing high adhesion and heat resistance after curing. CONSTITUTION:An epoxy resin composed of 4.4'-bis(2''.3''-epoxypropoxy)-3.3'. 5.5'-tetramethylbiphenyl, a curing agent and, when needed, a curing accelerator are mixed, crushed and classified to give the objective powder composition. As the curing agent, is preferably cited an acidic curing agent such as novlak phenolic resin, acid anhydride as well as an amine curing agent such as aromatic amine, dicyandiamide, which has most preferably a melting point over 50 deg.C.
|
