发明名称 RESIN COMPOSITION FOR SEALING IC
摘要 PURPOSE:To provide a composition composed of an epoxy resin composition containing a liquid acrylonitrile-butadiene copolymer having carboxyl group at the terminal, having decreased thermal expansion coefficient as well as Young's modulus, keeping the glass transition point at a desirable level, and satisfying the PCT test. CONSTITUTION:An epoxy resin composition containing 5-40PHR of a liquid acrylonitrile-butadiene copolymer having carboxyl group at the terminal. The content of acrylonitrile in the copolymer is preferably 5-40%. The epoxy resin is the one liquid at the room temperature, and is e.g. bisphenol A-type epoxy resin, etc.
申请公布号 JPS60248769(A) 申请公布日期 1985.12.09
申请号 JP19840084829 申请日期 1984.04.25
申请人 MATSUSHITA DENKO KK 发明人 MIWA AKITSUGU;MIYAZAKI MASANOBU;FUKUI TAROU;HINO HIROHISA
分类号 C08L13/00;C08G59/00;C08L63/00;H01L23/29;H01L23/31 主分类号 C08L13/00
代理机构 代理人
主权项
地址