| 摘要 |
PURPOSE:To prevent electrostatic distruction by frictional electrification by forming a conductive film on a plastic-package surface. CONSTITUTION:A semiconductor chip 1 is assembled to a frame 2 with wire 3 etc. and is sealed around by a plastic 4 made by epoxy resin and the like, and the formation is completed by means that an Al film or a conductive antistatic agent film 5 and the like is formed on the surface and the back, or either one side of the plastic 4. An insulating antistatic agent may be applied on the plastic-package surface or the insulating antistatic agent may be intermixed to the plastic. |
