| 摘要 |
A soldering container so constructed as to be carried with a material to be soldered housed in it by means of a carrying mechanism at soldering. The container comprises an enclosable container body housing the material to be soldered. The container body has at least one communication passage for allowing communication between the inside and the outside of the container body. The container body is so constructed as to be able to be connected via the communication passage with an atmosphere conditioner for conditioning the inside atmosphere of the container body. |
