| 摘要 |
PURPOSE:To reduce the DC and high-frequency impedance between bonding pads and a mount by a method wherein the mount is made higher by providing a step, and the pellet is surrounded with a conductive ring of the same potential as that of the mount; then, pellet is bonded to the conductive ring. CONSTITUTION:A conductive ring pattern 61 is connected to the mount 13 at a low impedance in a DC and high-frequency manner with a four-sided side-surface metallize. Bonding pads 14, 15 to be set at the same potential as that of the mount 13 is DC and high-frequency manner are bonded to this conductive ring pattern 61. Further, this pattern is bonded to case leads 62, 63. This manner enables extreme reduction in the Dc and high-frequency impedance between the bonding pad 14 or 15 and the mount 13. Besides, the workability and the reliability can be improved without contamination of the bonding surface of the conductive ring pattern 61 with solder because this surface is made higher by providing a stepwise difference from the mount 13. |
