发明名称 ELECTROPLATING SOLUTION CONTAINING NONAQUEOUS SOLVENT AND ITS MANUFACTURE
摘要 PURPOSE:To enable multipurpose plating and to obtain a film with superior corrosion and heat resistances by carrying out electrolysis in a nonaqueous soln. contg. the prescribed percentage each of a compound such as org. acid or acid anhydride, a nonaqueous solvent and an electrolyte soluble in the nonaqueous solvent. CONSTITUTION:The nonaqueous soln. consisting of >=0.05wt% one or more kinds of compounds selected among org. acids, acid anhydrides, amines and beta-diketones, 0.05-10wt% electrolyte and the balance nonaqueous solvent is prepd. The electrolyte is soluble in the nonaqueous solvent. Electrolysis is carried out in the nonaqueous soln. at >=-250mVvsSCE potential using the metallic material of a pure metal or an alloy as an anode to manufacture an electroplating soln. consisting of >=0.01wt% metallic complex salt, 0.05-10wt% electrolyte and the balance nonaqueous solvent.
申请公布号 JPS60245797(A) 申请公布日期 1985.12.05
申请号 JP19840100040 申请日期 1984.05.18
申请人 SHIN NIPPON SEITETSU KK 发明人 KUROSAWA FUMIO
分类号 C25D3/10;C25D3/02;C25D3/12;C25D3/54 主分类号 C25D3/10
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