| 摘要 |
PURPOSE:To contrive to miniaturize the IC case of a semiconductor device by a method wherein the chips of the other plural semiconductor integrated circuits of the device are mounted or are performed a face down bonding or so forth on the surface of the chip of one semiconductor integrated circuit of the device. CONSTITUTION:The chip 1 of one semiconductor integrated circuit of a semiconductor device is mounted on an IC case 4 and the chips 2 of the other plural semiconductor integrated circuits of the device are mounted on the surface of the chip 1. The semiconductor device shown in this diagram is one in the structure, wherein a wire-bonding is performed on the chip 1 or the case 4, or the bonding electrodes for the chips 2 are provided on the chip 1 and a face down bonding is performed, the chips 2 are mounted on the chip 1 and a wire-bonding is performed on the chip 1. Moreover, the chip 1 can be performed a face down bonding on the case 4 instead of being mounted thereon. |
