发明名称 Solder beams leads
摘要 A solder bearing hybrid integrated circuit terminal 16 is formed from a metal strip so that one finger 26 of the clip portion 18 is formed by the strip being folded back on itself. A second opposing finger 28 spaced from the first finger 26 includes in its end portion a slot 30 which extends around the free end of the finger 28 to form a solder preform clamp 34 by a reverse curving of the metal strip about the free end of the second finger 28. A stem 20 extends from the clip 18 opposite and parallel to the direction of the fingers 26, 28. This permits clearer access to the substrate 12 to which the terminal 16 is assembled and soldered. The stem 20 may later be bent at right angles to the substrate 12 for assembling the finished device 44 to a circuit board. Stop tab 36 are provided at the bottom of the recess between the fingers 26,28 for spacing the edge of the substrate 12 from the metal strip which forms the clip 18 of the terminal 16.
申请公布号 US4556276(A) 申请公布日期 1985.12.03
申请号 US19830492213 申请日期 1983.05.06
申请人 AT&T BELL LABORATORIES 发明人 CURTIS, III, HAZEN
分类号 H05K3/34;(IPC1-7):H01R4/02;H01R11/22 主分类号 H05K3/34
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