发明名称 ATMOSPHERE FORMING DEVICE FOR WIRE BONDING
摘要 PURPOSE:To maintain the circumferential part of a ball in a reducing or inert atmosphere during the period between the time when the ball is formed and the point of bonding by a method wherein reducing or inert gas is jetted into a cylinder from the side face of the cylindrical cover which is positioned enveloping a capillary. CONSTITUTION:A cylindrical cover 1 is fixed to a bonding head or an X-Y table, it is electrically insulated and constituted in such a manner that it envelopes a capillary 2. A gas sucking hole 3 is provided on the side face of the cylindrical cover 1, gas is injected, and inside the cylindrical cover 1 is maintained in a reducing atmosphere or an inert atmosphere. Accordingly, as the oxidization of the ball 7, which is formed when it is fused by the heat of electric discharge, is prevented and an excellent and stabilized bonding can be performed at all times even when the wire other than a gold wire such as an aluminum wire and a copper wire are used.
申请公布号 JPS60244034(A) 申请公布日期 1985.12.03
申请号 JP19840098484 申请日期 1984.05.18
申请人 MITSUBISHI DENKI KK 发明人 ICHIMURA HIDEO;OKAMURA MASAMITSU
分类号 B23K20/00;B23K20/14;B23K20/16;H01L21/60 主分类号 B23K20/00
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