| 摘要 |
PURPOSE:To simplify process and improve productivity by a method wherein after a distribution unit, which is pressurized and mounted with a semiconductive chip, chip parts, an outside contact terminal and interfacial terminal, is subjected to plural stages lamination, a thermosetting resin is poured and integrated. CONSTITUTION:A semiconductive chip 6 and chip parts 5 are mounted on an organic film 12 and connected to a thick film of conductive wiring between terminals 13 and additionally, they are enabled to be connected with outside by a outside contact terminal 19. A thermosetting resin is filled between these elements, and mold and cured as one body. According to such a method, the semiconductive chip, the chip parts and contact element are integrated with the contact between these elements and a circuit module sealed into resin can be formed by four successive processes, that is, wiring-loading the parts-lamination- integral seal forming. Hence, the number of processes can be reduced and productivity can be improved. |
