| 摘要 |
PURPOSE:To facilitate handling and to improve reliability of connection by a method wherein a pattern of conductivity is set up, so as to conduct a bump electrode of semiconductive pellet with wiring terminal on a glassepoxy substrate. CONSTITUTION:A semiconductive pallet 12 and a pattern 15, whose objective is to lead out on a polyimide film 19, are fixed and conducted. Thereafter, the pattern 15 causes the semiconductive pellet 12 and a distribution terminal part 11 disposed on a glassepoxy substrate 10 to be fix and conducted by means that the silver Ag paste 16 causes to be fix and conducted in conformity with the pitch of the wiring terminal part 11. Hereby, the semiconductive pellet 12 can be connected with outside electrically and mechanically and a projecting part from a frame of the lead is removed and also the problem such as etching process and bend of the lead at the time of handling thereafter are solved. |
