| 摘要 |
A semiconductor device includes a semiconductor element (21) having a cathode (21d) divided into a plurality of islands, each of the cathode islands (21d) being electrically connected through a cathode insert (24). The cathode insert (24) comprises a cup-shaped first conductor (241, 245) and a second conductor (242, 246) fitted into and kept in electrical contact with the first conductor (241, 245). The cup-shaped first conductor (241, 245) is disposed such that its bottom is in electrical contact with the plurality of the cathode islands (21d). The cathode side of the semiconductor element (21) is pressed against the anode side thereof for good liberation of heat.
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