发明名称 VAPOR DEPOSITION APPARATUS
摘要 PURPOSE:To vapor-deposit the vapor depositing substance on the material to be vapor deposited in excellent yield in case of forming a thin film-shaped vapor deposited layer on the surface of the body to be vapor-deposited by providing a vapor guiding nozzle which is provided with a heater at the upper part of a vapor depsition source toward the body to be vapor-deposited. CONSTITUTION:Nozzles 41, 51 are fitted to the opening parts of upper faces of the vessels 4, 5 incorporated with a main evaporation source 2 and a subevaporation source 3 which are arranged to the lower parts of the bodies 1, 1 to be vapor-deposited. The vapor for vapor deposition is directed toward respective bodies 1, 1 to be vapor-deposited by directing the mouth parts 41a, 51a of the respective nozzles toward the surfaces of lower parts of the bodies 1, 1 and also the vapor for vapor deposition is prevented from coagulating and adhering to the inner faces of nozzles by heating heaters 42, 52 to the respective nozzles 41, 51. Since the vapor for vapor deposition from the evaporation sources is concentrated and collected on the bodies 1, 1, the expensive vapor for vapor deposition can be utilized for the vapor deposition in high yield.
申请公布号 JPS60243266(A) 申请公布日期 1985.12.03
申请号 JP19840097824 申请日期 1984.05.16
申请人 TOSHIBA KK 发明人 YOSHIOKA HITOSHI
分类号 C23C14/24;C23C14/22;(IPC1-7):C23C14/22 主分类号 C23C14/24
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