| 摘要 |
PURPOSE:The titled composition, consisting of a specific epoxy compound, photopolymerizable compound and thermal polymerization initiator, primarily curable by active rays, e.g. ultraviolet rays, and completely curable by heating, and having improved adhesive property and chemical and water resistance, etc. CONSTITUTION:A curable resin composition obtained by incorporating (A) an epoxy compound having at least two epoxy groups in the molecule with (B) a photopolymerizable compound having one or more carboxyl groups in the molecule, e.g. acrylic acid, methacrylic acid and a compound expressed by the formula (R1 is H or methyl; R2 and R3 are general residue; A is ester bond; m and n are integers 1-3) alone or together with (C) a photopolymerizable compound other than the component (C), and further adding (D) a thermal polymerization initiator, e.g. a peroxy ester or peroxyketal, thereto. The compounding ratio of the components is preferably as follows; 20:80-80:20 weight ratio between the components (A) and the total of the components (B) and (C), and the amount of the component (D) is 0.5-10wt% based on the total of the components (A), (B) and (C).
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