| 摘要 |
PURPOSE:To mold a resin around a semiconductor chip bonded to a lead frame, without generating flashes, by molding the resin in the condition wherein seal plates made of an elastic material are intermediately disposed respectively between the lead frame and an upper metallic mold and between the lead frame and a lower metallic mold. CONSTITUTION:The lead frame 1 with the semiconductor chip 2 bonded thereto is placed between the upper and lower metallic molds 3, 4, and a resin 9 is molded by pouring it around the chip 2. In this case, the seal plates 5, 6 made of an elastic material and provided with openings 7, 8 at mold parts are intermediately disposed respectively between the upper surface of the lead frame 1 and the lower surface of the upper mold 3 and between the lower surface of the frame 1 and the upper surface of the lower mold 4. Preferably, the seal plates 5, 6 are tentatively adhered respectively to both surfaces of the lead frame or the surfaces of the molds before placing the lead frame 1 between the molds. |
