发明名称 WIRE BONDING METHOD
摘要 PURPOSE:To prevent static electricity frm being generated in the members located in the wire transporting passage and to allow wire to flow smoothly during the wire bonding operation, by bonding the wire by means of a device provided with an antistatic film in the portions of the wire transporting passage engaged with the wire. CONSTITUTION:A wire is bonded with an antistatic film provided in the engaging portion in the wire transporting passage. This film is formed by spraying an antistatic agent, for example, on a spool 2, a guide plate 3, an upper clamper 4 and a lower clamper 5 ar least on their surfaces or members engaged with gold wire 1. In such a manner, the gold wire 1 can be transported smoothly during the rapid wire bonding operation. The antistatic film provides more desirable effect when it is planished, after applying, by buffing with cloth such as gauze or the like or by polishing.
申请公布号 JPS60242655(A) 申请公布日期 1985.12.02
申请号 JP19840097432 申请日期 1984.05.17
申请人 TOSHIBA KK 发明人 YAMAGUCHI MASAYOSHI;WATANABE TAKAO
分类号 H01L21/60 主分类号 H01L21/60
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