| 摘要 |
PURPOSE:To improve the reliability of the circuit substrate for the watch by interposing the bonded part of an IC wireless bonded to a flexible printed board between projections on the top of a mold and elastically receiving the projections on the bottom of the lower mold at the back surface of the IC to thereby mold it with thermoplastic resin. CONSTITUTION:The IC 2 is wireless bonded through lead wires 16 to the flexible printed board 3 of a circuit substrate for the watch, the bonded part of the IC is interposed between the projections 19 of the upper mold of a mold 17, the back surface of the IC is elastically interposed with the projections 20 of the lower mold of the mold 17 with a spring 30, then thermoplastic resin is filled in the space, and the IC is thus resin molded. Thus, the bent part of the lead wires 16 can be eliminated and the shoulder touch can also be completely removed. Consequently, it remarkably improves the reliability of the circuit substrate and enables the reduction in the size, thickness and the cost. |
