| 摘要 |
PURPOSE:To reduce the number of manufacturing steps to enhance the productivity rate and improve qualities by a method wherein a conductive metal piece fixed by soldering to the lower, rear side of a frame-type lead wire is pressed against solder paste for thermal fusion. CONSTITUTION:Onto prescibed spots in a wiring on a wiring substrate 1, soldering paste 2a is applied by printing. Next, a frame-type lead wire 11, so bent that its upper portion may stand vertical to the substrate 1 and provided with a conductive metal piece 12 welded to its lower, rear side, and another electronic part 3 are pressed against the paste 2. The junctions are heated for fusion and then cooled for hardening. Accordingly, with the metal piece 12 fixed to the lower, rear side of the frame-type lead wire 11, pressing down to the paste 2 of the frame-type lead wire 11 may be facilitated. Besides, solerability is improved. |
