| 摘要 |
PURPOSE:To prevent short circuiting between a magnetic substrate and lead-out wires in the stage of connecting the lead-out wires to a circuit system by forming a groove in which an insulator is packed to the part under the wire bonding part of the lead-out wire. CONSTITUTION:A thin film 2 for a gap in common use as an insulating film is formed on the magnetic substrate 1. A conductor coil 3 is formed on the film 2 and a magnetic material layer 5 is formed in the form of crossing the coil via the insulating film 4. The lead-out wires 6, 7 are connected to the coil 3. The groove part is formed to such substrate and the part 9 packed with the insulator is formed in the groove part. The part 9 is formed on the substrate 1 which corresponds to part of the wires 6, 7. The coupling of the magnetic head and the circuit system is executed in the position of the wires 6, 7 corresponding to the part 9. Such a drawback as the rupture of the film 2 when wire bonding is executed and the consequent short circuiting between the wires 6, 7 and the substrate 1 are thus eliminated. |
