| 摘要 |
PURPOSE:To prevent between wirings from shortcircuiting by forming a recess in the wirings to avoid a crossing portion, thereby separating the wirings from an unnecessary conductive layer. CONSTITUTION:Wirings 8 are extended and disposed through a crossing portion for crossing U-shaped grooves 3 extending in different directions substantially in the same direction on the top of a semiconductor substrate 1. Recesses 8a, 8b are formed in the wirings 8 to avoid the crossing portion of the grooves 3, the wirings 8 and a remaining unnecessary conductive layer C are separated via a recess 5 formed on the upper surface of the isolating region of the crossing portion to prevent between the wirings 8 from shortcircuiting. The recesses 8A, 8B may be selected in size and shape by the masking error with the pattern formed on the substrate 1 in the manufacturing steps before the unnecessary wirings 8 of the size, shape of the layer C. |
